© Copyright 1999-2003, ITherm and JM Technology Solutions, Inc.
To submit a paper for consideration, please use the on-line abstract submission form.
All abstracts must be received by September 14, 2001. Abstracts must be plain text only.
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Original papers are solicited in the general areas of Thermal Management, Mechanics (thermo-mechanical and mechanical), and Multidisciplinary Topics in Emerging Technologies.
System-Level Thermal Design of Data and Voice Equipment
Thermal Interface Materials, Modeling and Characterization
Heat Sink Characterization and Optimization
Optimization of & Low-Cost Enhancements to Heat Sinks
Achieving Air Cooling Limits
Phase Change Materials and Thermosyphons
Thermal Management of Military Avionic Systems
Electronic Systems, Photonics: Thermal Issues
Simulation and Modeling 1: Thermal
Simulation and Modeling 2: Thermal
Advanced Simulation Methods for Electronics Cooling
Fundamentals And Applications of Conduction
Fundamentals and Applications of Convection Cooling
Experimental Methods, Model Validation, & Material Characterization in Thermal Management
Thermal Packaging Design For Sustainability
Manufacturing & Assembly Related Transport and Thermo-Mechanical Aspects
High Flux Liquid Cooling Techniques
Printed Circuit Board Level Thermal Issues for Next Generation Technologies
Thermal Aspects of Burn-In Equipment
CAD & Computational Methods in Mechanics and Thermomechanics
Experimental Mechanics:Methods and Model Validation
MEMS and Micromechanics
Analytical Methods - Mechanics
Simulation and Modeling - Mechanics
Characterization of Mechanical Properties of Materials
Mechanics of Solder Alloys:Lead and Lead-free
Airborne and Space Systems
MEMS Thermal Management
Integrated Biochips and Bioelectronics
Power Electronics Systems
Nanoscale Phenomena In Electronics
Solid-State Cooling: Advanced Thermoelectrics and Photonic Coolers
Optoelectronics: Thermal and Thermo-Mechanical Issues
Proposals are solicited for panel discussion topics addressing contemporary issues of broad interest to ITherm. These should include a title, an abstract describing the theme(s) to be addressed, and a list of potential panelists.