Conference Program Keynote Speakers

© Copyright 1999-2002, ITherm and JM Technology Solutions, Inc.

"Some Recent Topics on the Strength Reliability of Solder Joints in Electronic Packaging"

Prof. Masaki Shiratori is with the Department of Mechanical Engineering ,Graduate School of Engineering, Yokohama National University, Kanagawa, Japan (e-mail: [email protected]). Prof. Shiratori graduated from the Department of Precision Machinery Engineering, University of Tokyo with Bachelor of Engineering (1966) and got postgraduate and . Dr. of Engg. from the Department of Precision Machinery Engineering., University of Tokyo in 1971. He joined the faculty of Yokohama National University as a Lecturer in 1971, became an Associate Professor 1972 and a Professor in 1984. Professor Shiratori is Member of the Executive Committee of JSME (Japan Society of Mechanical Engineering), JSCE (Japan Society of Computational Engineering and Science, and JIEP (Japan Institute of Electronic Packaging). His areas of research are: Computational Mechanics, Fracture Mechanics, Strength of Materials. His Keynote Speech at ITherm 2002 will be on...

At first the author will review the basic approach for estimating the thermal fatigue lives of eutectic solder joints in electronic packaging. Then he will review some recent topics on the strength reliability of solder joints, every one of which is the key issue to be solved in order to make a break through in the technology of the next generation packaging. These are

    1. Lead free solder joints
    2. Drop impact test
    3. Warpage analysis of Printed Circuit Boards, and
    4. Stochastic structural reliability design

"Digital Imaging: the Next Frontier"

Dr. Evan Smouse is Director of Strategic Technology for Hewlett-Packard's Imaging & Printing Systems Business. He drives the development of consistent technology strategies and roadmaps across the Imaging & Printing Systems business to deliver solutions that reinforce HP's leadership in core businesses and enable rapid acceleration of growth in new markets. He represents IPS on cross-HP technology teams working to create transformational solutions. He has key responsibility for the development of relationships with external business partners and with universities.

At HP, Dr. Smouse has managed several inkjet R&D programs. He was responsible for research and development of new methods and technologies to achieve high image quality, high throughput, and high reliability with thermal inkjet technology (TIJ) printing systems. He also had responsibility for inventing tools and methodologies for understanding and measuring printed image quality attributes.

Dr. Smouse has also worked as a Senior Technologist for HP/Microsoft Architectures in the Mobile Computing Division. He has a Ph.D in Mathematical Statistics from Oregon State University.

"Challenges in the Thermal Management of Microprocessors"

Dr. Ravi Mahajan is a Senior Engineer in the Assembly Path-finding Group that is part of Assembly Technology Development in Chandler, Arizona. His group is responsible for establishing strategic direction for Assembly and Packaging of next generation semiconductor devices. Dr. Mahajan is directly responsible for establishing the Packaging and Assembly architecture for silicon at the 65 nm node. He also chairs a strategic working group responsible for setting directions for thermal management of next generation micro-processors and another that is responsible for collaborative research in thermal management. Dr. Mahajan is responsible for overseeing external research in Assembly and Packaging and represents Intel Corporation in the Technical Advisory Board of the Semiconductor Research Corporation. Dr Mahajan received his B.S. degree in Mechanical Engineering from the University of Bombay (1985), his M.S. degree in Mechanical Engineering from the University of Houston (1987), and his Ph.D. degree in Mechanical Engineering specializing in Fracture Mechanics from Lehigh University (1992). Dr. Mahajan holds several patents in packaging, has authored several technical papers and edited two conference proceedings for the Society of Experimental Mechanics. He is the founder and currently one of the editors of the Intel Assembly and Test Technology Journal, in INTEL internal journal that documents current progress and future challenges specific to INTEL. His e-mail is [email protected].

The continued performance evolution of microprocessors has resulted in some significant technical and cost challenges in thermal management. This talk will focus on describing the specifics of the thermal management challenges. It will track the evolution of thermal requirements and the future trends. It shows that when faced with the need to provide thermal solutions the engineering practioner is faced simultaneously with technical and business aspects of the issue, both of which dictate the final solution. A tendency to extend evolutionary solutions is typically the path of lower resistance. However, a case is made for the need to develop technologies for future challenges and to have a portfolio of solutions and thermal management approaches that can be brought to bear effectively when needed.

"Least-Energy Optimization of Air-Cooled Heat Sinks For Sustainable Development"

Prof. Avram Bar-Cohen is Professor and Chair of Mechanical Engineering at the University of Maryland, where he continues his research in the thermal management of Micro/Nano systems. His interests include thermal design, ebullient heat transfer, and thermal phenomena in microelectronic, photonic, and biological systems, as well as technology forecasting and management of technology. Bar-Cohen currently serves on the Steering Committee of ASME's Nanotechnology Institute and is Chair of the US Scientific Committee of the International Heat Transfer Assembly (1998-2002).

Avram Bar-Cohen is co-author (with A.D. Kraus) of "Design and Analysis of Heat Sinks" (1995) and "Thermal Analysis and Control of Electronic Equipment" (1983) and has co-edited nine books in this field, including the ASME Press Series Advances in Thermal Modeling of Electronic Components and Systems and the John Wiley & Sons Series in Thermal Management of Microelectronic and Electronic Systems. He has authored and co-authored some 220 Journal papers, Refereed Proceedings papers, and Chapters in books, and has delivered 40 Keynote, Plenary, and Invited Lectures at major technical Conferences and Institutions.

He received the 2000 ASME Worcester Reed Warner Medal, "..for outstanding contributions to the literature in the area of heat transfer," and was earlier recognized with the ASME Heat Transfer Memorial Award and the ASME Curriculum Innovation Award in 1999, the ASME/IEEE ITHERM Memorial Award in 1998, ASME Edwin F. Church Medal in 1994, and the THERMI Award from the IEEE/Semi-Therm Conference in 1997. He is a Fellow of the ASME and of IEEE, a distinguished Lecturer for IEEE, was the Founding Chairman of the ITHERM Conference in 1988, and served as the General Chairman for the first InterPack (International Intersociety Packaging Conference) in 1995.

The development of microelectronic heat sinks, which are compatible with sustainable development, involves the achievement of a subtle balance between a superior thermal design, minimum material consumption, and minimum pumping power. Due to the explosive growth in the power dissipation of electronic systems, substantial material streams, as well as energy consumption and entropy generation rates, are associated with the cooling of computers, telecommunication modules, and other categories of electronic equipment. This ITHERM Keynote explores the potential for the least-energy optimization of natural and forced convection cooled, rectangular plate heat sinks. A Coefficient of Performance, COPT, relating the cooling capability of the heat sink to the energy invested, is defined and used to compare heat sink configurations and cooling modes. Guidelines for "sustainable" heat sink designs, operating in natural and forced convection, are suggested. The COPT - based least-energy optimization is compared and contrasted to the more familiar entropy generation minimization (EGM) methodology.

"An Overview of Issues and Solutions in the Thermal Management of Military Electronic Systems"

Dr. Donald C. Price is a Principal Fellow for Raytheon Electronic Systems in Dallas, Texas. Dr. Price received the BSME and MSME degrees from Southern Methodist University in Dallas, Texas, and the Ph.D. degree from Oklahoma State University in Stillwater, Oklahoma. Following graduation, Dr. Price served as Associate Professor of Mechanical Engineering at SMU with emphasis on teaching and research in the fields of thermodynamics, heat transfer, heat exchanger design, fluid mechanics, gas dynamics, and aerodynamic heating. He has served as an Adjunct Professor of Mechanical Engineering at SMU since 1985. Don is also co-founder and co-director of the Sub-Micron Electro-Thermal Sciences Laboratory at SMU. Dr. Price joined Texas Instruments in 1972 and, as a Raytheon employee since 1997, continues to work for that same defense electronics group. During his tenure with TI and Raytheon, Dr. Price has developed solutions to thermal management problems for several major military electronic systems including: high speed missile systems, electro-optical night-vision systems, airborne pod sensor systems, military computers, and phased-array radar systems. These solutions have employed the use of finite element thermal models, computational fluid dynamics, compact heat exchanger design, air-cycle and vapor-cycle refrigeration systems, and the application of heat pipes, thermoelectric devices, and phase-change materials. In conjunction with this work, Dr. Price has been awarded four US patents and two foreign patents. He has published 13 journal articles and 13 papers in conference proceedings. Dr. Price serves as Vice-Chair of the ASME K-16 Committee on Heat Transfer in Electronics and as a member of the EPPD Executive Committee. Dr. Price served as Technical Chair for the 2001 ASME International Electronic Packaging Conference (InterPack'01) and is currently serving as General Chair for InterPack'03. Dr Price is also very active in ASME at the local level, serving the local EPPD chapter and the North Texas Section in several capacities. In addition to these professional activities, Dr. Price has made ten presentations on professionalism, entitled "Ten Keys to a Successful Engineering Career", to a variety of engineering and student groups. The ASME North Texas Section EPPD selected Dr. Price as Engineer-of-the-Year in 1997 and the ASME North Texas Section selected him as the Engineer-of-the-Year for 1998. In 2002, the Dallas Chapter of the Texas Society of Professional Engineers selected Dr. Price as the Engineer of the Year. Most recently, ASME elevated Don to the member grade of ASME Fellow.

Thermal management of electronics is vital to the successful design, manufacture, and tactical operation of a variety of military electronic systems. Designs employ all modes of heat transfer including: conduction, natural and forced convection, aerodynamic heating, radiation, and two-phase heat transfer. A variety of heat sinks and heat exchange devices are employed, including the use of cold plates, electronic chassis coldwalls, compact heat exchangers, air- and vapor-cycle refrigeration systems, phase change materials, thermoelectric devices, spray-cooling, heat pipes and capillary pump loops. This keynote address will describe several military electronic systems on a variety of platforms and discuss the thermal management issues involved in the design of the thermal control systems. Specific examples will be employed in the presentation to emphasize the variety of thermal management problems encountered and the solution techniques employed.