Itherm
Conference Program Professional Short Courses


© Copyright 1999, ITherm and JM Technology Solutions, Inc.

JM Technology Solutions, Inc.
Thermomechanical Analysis of Electronic Packages

Instructors

Erdogan Madenci
Erdogan Madenci received the B.S. degree in both Mechanical and Industrial Engineering and the MS. degree in Applied Mechanics from Lehigh University, Bethlehem, PA, in 1980, 1981, and 1982, respectively, and the Ph.D. degree in Engineering Mechanics from the University of California, Los Angeles in 1987. He is currently a Professor in the Department of Aerospace and Mechanical Engineering, The University of Arizona, Tucson. Professor Madenci has conducted research in the area of thermomechanical analysis of electronic packages for Intel, Ericsson, Sweden and Semiconductor Research Corporation.

Ibrahim Guven
Ibrahim Guven received the B.S. and M.S. degrees from the Middle East Technical University, Ankara, Turkey in 1991 and 1994, respectively, and the Ph.D. degree in Mechanical Engineering from the University of Arizona, Tucson in 2000. He worked as an Engineering Intern at Hewlett-Packard, Intel and Ericsson, Sweden. He is currently an Assistant Research Professor in the Department of Aerospace and Mechanical Engineering, The University of Arizona, Tucson.


Course Outline

  • Overview of material systems in electronic packaging (30 min)
  • Mechanical behavior fundamentals (1 hr)
  • Deformation characteristics (30 min)
  • Failure mechanisms
    • Delamination (30 min)
    • Solder fatigue (30 min)
  • Failure detection and evaluation methods (1 hr)
  • Numerical analysis techniques (30 min)
  • Modeling assumptions and simulation techniques (30 min)
  • Case study I: Delamination analysis (fracture parameters) (45 min)
  • Case study II: Solder joint reliability (thermal cycling) (45 min)
  • Case study III: Solder joint reliability (thermal cycling) (45 min)
  • Case study IV: Solder joint reliability (bend cycling) (45 min)


Course Summary

This course begins with an overview of the mechanical behavior of materials that are common to electronic packages. The deformation characteristics and failure mechanisms such as delamination and solder joint fatigue are discussed along with failure detection and evaluation methods. Modeling assumptions and simulation techniques with finite element analysis are described in order to predict solder joint fatigue by using commonly accepted failure criteria. Case studies concerning delamination prediction and fatigue life prediction under thermal and bending cyclic loading will be presented by using ANSYS. Prerequisites: Basic training in Mechanical Engineering.